V-1. SRN-110 SPUTTERING SYSTEM

V-1. SRN-110 SPUTTERING SYSTEM
■ Six-sided transport chamber ( eight-sided option )
■ Two vacuum cassette loadlocks with automatic doors
■ Robotic arm for wafer handling
■ Isolation valves
■ Integrated wafer alignment module
■ Capacity to four independent process chambers
■ Available to RF and DC process
■ Full erosion target surface
□ Low particle process
□ Long target life time
■ High vacuum pumping system ( turbo or cryo pump )